Sony precocious did a brushed refresh of its PS5 console with a caller variant known arsenic the CFI-1202 that offers little temps & powerfulness input. The caller console is lighter, runs cooler, and consumes little powerfulness & this is each acknowledgment to the refreshed AMD Obreon Plus SOC hailing the TSMC 6nm process node.

Sony's PS5 "CFI-1202" Console Variant Features Enhanced 6nm AMD Oberon Plus SOC: Reduced Die Size, Lower Power & Cooler Operation

In a recent teardown video published by Austin Evans, the Techtuber noticed that the Sony PS5 console was shipping successful a caller variant that is lighter, cooler, & little powerfulness hungry. This caller PS5 variant is labeled arsenic the "CFI-1202" and we tin present get to the bottommost of wherefore it is truthful amended than Sony's archetypal PS5 variants (CFI-1000 / CFI-1001).

Tech outlet, Angstronomics, has confirmed successful their exclusive that the Sony PS5 (CFI-1202) comes with an enhanced AMD Oberon SOC known arsenic Oberon Plus which utilizes the TSMC N6 process (6nm). TSMC has made it truthful that their 7nm (N7) process node is plan regularisation compatible with the 6nm EUV (N6) node. This allows TSMC partners to easy larboard existing 7nm chips to the 6nm node without moving into large complexities. The N6 process node offers an 18.8% transistor density summation and besides reduces powerfulness depletion which successful instrumentality reduces temperatures.

This is wherefore the caller Sony PS5 consoles are lighter and diagnostic a smaller heatsink compared to the motorboat variants. But that's not all, we besides get to spot a marque caller spot changeable of the AMD Oberon Plus SOC sitting adjacent to the 7nm Oberon SOC. The caller dice measures astir 260mm2 which is simply a 15% simplification successful dice size compared to the 7nm Oberon SOC (~300mm2). There's different vantage of moving to 6nm and that's the fig of chips that tin beryllium produced connected a azygous wafer. The outlet reports that each Oberon Plus SOC wafer tin nutrient astir 20% much chips astatine the aforesaid cost.

What this means is that without affecting their cost, Sony tin connection much Oberon Plus chips to beryllium utilized successful PS5 and that tin further trim shortages successful the marketplace that the current-gen consoles person faced since their launch. It is besides reported that TSMC volition signifier retired 7nm Oberon SOCs successful the aboriginal and determination wholly to 6nm Oberon Plus SOC which volition effect successful 50% much chips to beryllium made per wafer. Microsoft is besides expected to utilize the 6nm process node for its refreshed Arden SOC successful the aboriginal for its Xbox Series X consoles.

News Source: Angstronomics